Small sputtering device
The compatible substrate can be processed up to a maximum of φ1 inch! Equipment equipped with a dual gas nozzle.
The "Compact Sputtering Device" is a laboratory high-vacuum thin film deposition system equipped with a 1.3-inch magnetron sputter cathode. It is equipped with an RF power supply with a matching unit for discharge. It features a dual gas nozzle capable of supporting oxidation reaction sputtering. Additionally, it can process substrates up to a maximum diameter of 1 inch. 【Features】 ■ Equipped with a 1.3-inch magnetron sputter cathode ■ Comes with an RF power supply with a matching unit for discharge ■ Features a dual gas nozzle capable of supporting oxidation reaction sputtering ■ Can process substrates up to a maximum diameter of 1 inch *For more details, please refer to the external link page or feel free to contact us.
- Company：和泉テック
- Price：Other
